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Adhesion Enhancement of Polyimides Coatings On Metal Foils By Organic Di-Acids

IP.com Disclosure Number: IPCOM000120442D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Gini, D: AUTHOR [+2]

Abstract

Disclosed is the use of di-acids, such as diglycolic and thiodiglycolic, to increase adhesion of polyimides to copper foil surfaces.

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This is the abbreviated version, containing approximately 100% of the total text.

Adhesion Enhancement of Polyimides Coatings On Metal Foils By Organic
Di-Acids

      Disclosed is the use of di-acids, such as diglycolic and
thiodiglycolic, to increase adhesion of polyimides to copper foil
surfaces.

      Polyimides with molecular weights of 10,000 - 50,000 and
viscosities from above 10,000 cps down to 2,000 cps have poor
adhesion to copper foil surfaces when dried.  High viscosity
polyimides were diluted with MEK or other suitable solvents and
coated.  Low adhesion resulted, including separation at the polyimide
- copper foil interface on drying at elevated temperatures.

      No prior special treatment of the copper was used; before the
application of ethanol water, diluted di-acid to the copper foil,
which resulted in increased adhesion and no separation of the
polyimide from the metal foil on drying.

      Adhesion enhancement also results with addition of di-acids to
some suitable polyimide coating solvents.

      Disclosed anonymously.