Browse Prior Art Database

Method of Aligning and Locating Chip/Card for Direct Chip Assembly

IP.com Disclosure Number: IPCOM000120450D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 24K

Publishing Venue

IBM

Related People

Desai, K: AUTHOR [+3]

Abstract

The concerns of chip C4 misalignment/skewing and eutectic solder to C4 solderability can be eliminated by inverting the placement configuration using precision chip to card locating tool.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Method of Aligning and Locating Chip/Card for Direct Chip Assembly

      The concerns of chip C4 misalignment/skewing and eutectic
solder to C4 solderability can be eliminated by inverting the
placement configuration using precision chip to card locating tool.

      In the figure, a bottom plate 1 having a cavity for each chip
holds the chip 2 with C4 balls facing up.  The card 3 is then placed
using the locating pins 4 to assure the card pad alignment to chip
C4.  The movable clamp 5 is fastened to the bottom plate, preventing
the card from bending during the solder reflow process.

      Disclosed anonymously.