Browse Prior Art Database

Process to Clean Metal Surfaces Prior to Photoresist Apply

IP.com Disclosure Number: IPCOM000120453D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Albrechta, SM: AUTHOR [+2]

Abstract

Disclosed is a process to clean the surface of a stainless steel and copper laminate prior to the application of a dry film photoresist by conventional hot roll lamination.

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Process to Clean Metal Surfaces Prior to Photoresist Apply

      Disclosed is a process to clean the surface of a stainless
steel and copper laminate prior to the application of a dry film
photoresist by conventional hot roll lamination.

      Conventional metal cleaning and etching techniques were found
to be unsatisfactory to clean both the stainless steel and the copper
surfaces in a laminate simultaneously.  If the surfaces are not
properly cleaned and prepared, the dry film photoresist will have
insufficient adhesion to the metals to withstand the subsequent
stainless steel and copper etching to manufacture the desired part.

      The cleaning process disclosed utilizes a chromium etchant
consisting of a potassium permanganate solution followed by a rinse
by an oxalic acid solution.  A subsequent rinse with deionized water
and a drying step complete the required sequence to clean the two
metals.

      The essentials of the entire photolithographic process are
shown in the figure.

      Disclosed anonymously.