Browse Prior Art Database

Diced Chip Prober/Carrier

IP.com Disclosure Number: IPCOM000120457D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 45K

Publishing Venue

IBM

Related People

Lukaitis, JM: AUTHOR

Abstract

A chip carrier device has been proposed which is capable of having a probe arrangement mounted on it so as to permit electrical reliability and stress testing at the chip level for semiconductor applications. The device makes it possible to perform non-destructive reliability testing or burn-in at the chip (diced) level.

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This is the abbreviated version, containing approximately 91% of the total text.

Diced Chip Prober/Carrier

      A chip carrier device has been proposed which is capable of
having a probe arrangement mounted on it so as to permit electrical
reliability and stress testing at the chip level for semiconductor
applications.  The device makes it possible to perform
non-destructive reliability testing or burn-in at the chip (diced)
level.

      In conventional operations reliability and stress testing at
the chip level normally cannot be performed without the use of
substrate mounted chips.  The proposal offers a means of salvaging
the chips used in reliability stress testing or qualifications and
also provides a reusable chip holder.

      Referring to the Figure, the proposed chip carrier 1 has
properly sized wells 2 which receive the semiconductor device under
test (DUT) 3.  Insulating washers 4, which may also be used as
spacers, are mounted on the carrier after which the probe 5 is
snapped into the carrier and secured firmly in place.  The washers
function to keep heat from the chip off of the probe and allow for
varying lengths of the probe as it is reused.  A reusable connector
6, equipped with pins 7, is used to make the connection to oven
burn-in equipment.  Once the tests performed on the semiconductor are
complete, it is removed from the carrier, which is reusable and may
be used for testing additional devices.

      In addition to the advantages noted above, an additional one is
that the chips are more acceptable for failu...