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Height Adjustable Disconnectable Electrical Mini Links

IP.com Disclosure Number: IPCOM000120477D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 57K

Publishing Venue

IBM

Related People

Kim, J: AUTHOR [+4]

Abstract

A disconnectable electrical mini links connector is described which is height adjustable. Presently chips are connected to substrates by bonding techniques or tape automated bonding. In both cases it is difficult and risky to exchange mounted chips and the mismatch between the TCE's of silicon and the substrates restricts the reliability of these connections. The need for replaceability even forces the use of flexible connectors in the case of module to card or board connections like the pin in hole technologies.

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Height Adjustable Disconnectable Electrical Mini Links

      A disconnectable electrical mini links connector is described
which is height adjustable.  Presently chips are connected to
substrates by bonding techniques or tape automated bonding.  In both
cases it is difficult and risky to exchange mounted chips and the
mismatch between the TCE's of silicon and the substrates restricts
the reliability of these connections.  The need for replaceability
even forces the use of flexible connectors in the case of module to
card or board connections like the pin in hole technologies.

      With increasing miniaturization and increasing number of I/O's
per packaging unit of integrated circuits, like chips, modules,
cards, etc., new connector techniques are required.  Especially as
with increasing speed the electrical discontinuities of electrical
links cannot be tolerated anymore as they could in the past at slower
speed. Stop-line to stop-line or stop-line to mini-coax connections
have to be improved.  At the same time with increasing
miniaturization, much tighter geometrical tolerances are required
especially with regard to flatness of the parts. To relax this
situation and provide the needed electrical characteristics, the
following solution is provided to compensate for the unflatness of
both sides of the two packaging levels.

      As shown in the figure, a disconnectable and reusable dendrite
connector composed, for example, of palladium dendrites covered wi...