Browse Prior Art Database

Tape-Automated-Bonding Multichip Modules

IP.com Disclosure Number: IPCOM000120479D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 45K

Publishing Venue

IBM

Related People

Mok, LS: AUTHOR [+2]

Abstract

Disclosed is a high-power, multichip module bonded with Tape-Automated-Bonding (TAB) chips on both sides of the module substrates. High power is achieved by bringing the TAB chips directly in contact with the cold plate or heat sink. (Image Omitted)

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 90% of the total text.

Tape-Automated-Bonding Multichip Modules

      Disclosed is a high-power, multichip module bonded with
Tape-Automated-Bonding (TAB) chips on both sides of the module
substrates.  High power is achieved by bringing the TAB chips
directly in contact with the cold plate or heat sink.

                            (Image Omitted)

      The cross-sectional view of a typical TAB multichip module is
shown in the attached figure.  The TAB chips 10 are bonded on both
sides of the module substrate 11 with chips facing outward.
Elastomeric cushions 12 are placed between the chips 10 and the
substrate 11 before the chip bonding.  The cushions 12 will be
depressed when the heat sink 13 and the thermal conduction plate 14
are mounted to the module.  Because the leads of the TAB chips 10 are
quite flexible, the resilient force from the cushions 12 will push
the back of the chip 10 in good contact with the heat sink 13 and
the thermal conduction plate 14 and hence to provide a low thermal
resistance from the chips 10 to the heat sink 13 and the thermal
conduction plate 14.  The thermal resistance can be reduced further
if some thermal interface materials, such as grease, are added
between the chips 10 and the heat sink/thermal conduction plate
13/14.  The thermal conduction plate 14 is used to eliminate the need
of another heat sink on the other side of the module.  The heat sink
used here is for illustration purpose only and can be replaced by a
co...