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Seeding Poly(Phenylquinoxaline) Films for Electroless Metal Deposition

IP.com Disclosure Number: IPCOM000120484D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 69K

Publishing Venue

IBM

Related People

O'Toole, TR: AUTHOR [+2]

Abstract

Disclosed is a process for depositing metallic palladium particles onto films of poly(phenylquinoxaline) (PPQ). The palladium acts as a seed for subsequent electroless metallization.

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Seeding Poly(Phenylquinoxaline) Films for Electroless Metal Deposition

      Disclosed is a process for depositing metallic palladium
particles onto films of poly(phenylquinoxaline) (PPQ).  The palladium
acts as a seed for subsequent electroless metallization.

      PPQ has some attractive properties as a dielectric material
including good thermal stability (> 400~C), low water uptake, good
mechanical properties and a low dielectric constant (N 2.7).  To
metallize dielectrics, "wet" chemical techniques, such as electroless
metallization, are gaining increased popularity. Electroless
metallization requires a catalytic "seed" to initiate metal
deposition.  Palladium particles are most commonly used for this.
With polyimides, deposition of palladium can be readily achieved by
utilizing the ability of the dielectric to undergo reversible
reduction (i.e., accept electrons).  Following reduction of the
polyimide surface, exposure to a palladium salt solution results in
polyimide-to-palladium electron transfer with the deposition of
metallic palladium in and on the film.

      It is reported here that films of PPQ also possess the
necessary reversible redox chemistry which allows for this type of
seeding.  Cyclic voltammograms of thin PPQ films on optically
transparent electrodes were obtained in deaerated solution of 0.1 M
tetrabutylammonium tetrafluoroborate (TBABF4) in acetonitrile.  They
show that PPQ has one reversible reduction at E1/2 = - 1.45 V, and
another par...