Browse Prior Art Database

High Density Area Array Connector

IP.com Disclosure Number: IPCOM000120486D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 52K

Publishing Venue

IBM

Related People

Grebe, KR: AUTHOR [+4]

Abstract

Disclosed is a process of fabrication of a z-directional high density, high compliance area array connector.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 80% of the total text.

High Density Area Array Connector

      Disclosed is a process of fabrication of a z-directional high
density, high compliance area array connector.

      Employing Cu (or Au) wire of 1 mil or less diameter, many
parallel metal lines can be weaved in one direction in a conventional
fabric weaving tool.  Weaving of wires with 1 - 3 mils spacing can be
achieved 3-dimensionally.  Then high compliant elastomer is cast and
cured to form a big block of composite of elastomer and metal wires.
If the wires are weaved 2-dimensionally, then elastomer is screened
onto the metal wires and cured to form a sheet of the elastomeric
composite and then, the sheets are laminated together with elastomer
again in between, to form a block of the composite of elastomer and
metal wires.  Then the composite block of parallel metal lines and
elastomer is sliced with angle ranging from 5~to 45~.  Contact areas,
i.e., cross-sectioned areas of metal lines, are electrolessly Cu or
Au plated to form contact bumps, by dipping the sheets of interposers
into the electroless plating bath.  No seeding is necessary since
electroless plating will be selectively achieved onto the conductive
metal surface only. Interconnection can be made by placing the area
array interposer connector between two components to be connected,
and mechanically clamping them, as shown in Figure 1.

      Advantages of this interposer connector are:  (1) no alignment
necessary, since the wire pitch is much smaller...