Browse Prior Art Database

Elastomeric Interposer using Film-Supported Metal Conductors

IP.com Disclosure Number: IPCOM000120489D
Original Publication Date: 1991-Apr-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Graham, TG: AUTHOR [+6]

Abstract

Disclosed is a method for using well-known, low cost, flexible circuit technology to fabricate a high-compliance, laminated structure for use as a flexible interposer type connector.

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This is the abbreviated version, containing approximately 100% of the total text.

Elastomeric Interposer using Film-Supported Metal Conductors

      Disclosed is a method for using well-known, low cost, flexible
circuit technology to fabricate a high-compliance, laminated
structure for use as a flexible interposer type connector.

      The basic structure is shown in Figure 1.  A flexible circuit,
consisting of a number of parallel conductors separated by spaces, is
fabricated on both sides of a carrier of polyimide film using
standard flex circuit technology.  A number of these circuits are
then layered with elastomeric material and bonded.  The resultant
structure is sliced perpendicular to the conductors to create the
interposer.

      Disclosed anonymously.