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Thick Film Deposition Process for Producing High Density Metal Patterns of Uniform Width And Height in a Multiple Pass Process

IP.com Disclosure Number: IPCOM000120592D
Original Publication Date: 1991-May-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 4 page(s) / 160K

Publishing Venue

IBM

Related People

Andris, GS: AUTHOR [+2]

Abstract

Disclosed is a manufacturing method for achieving a multiple pass thick film deposition process. Multiple pass is defined as simultaneously filling punched vias and depositing a pattern of thick film conductive paste on two different conductive paste carriers before washing the screening mask. This technology requires the application of U.S. Patent 4,902,371 and several modifications to the thick film deposition process sequence.

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Thick Film Deposition Process for Producing High Density Metal Patterns
of Uniform Width And Height in a Multiple Pass Process

      Disclosed is a manufacturing method for achieving a
multiple pass thick film deposition process.  Multiple pass is
defined as simultaneously filling punched vias and depositing a
pattern of thick film conductive paste on two different conductive
paste carriers before washing the screening mask.  This technology
requires the application of U.S.  Patent 4,902,371 and several
modifications to the thick film deposition process sequence.

      Prior thick film deposition art is detailed in Figs. 1A, 1B, 1C
and 1D.  In Fig. 1A a screening mask 2 is attached to a frame 4.
This frame 4 is secured into position by clamps 1.  The conductive
paste carrier 6, supported by structure 7, is aligned and placed
against screening mask 2, using tapered alignment pins 5.  A
conductive paste pattern is then formed on the conductive paste
carrier 6.

      Fig. 1B details the thick film separation process. During the
thick film separation process, structure 7 and conductive paste
carrier 6 are vertically moved away from screening mask 2.  The
clamps 1 open when the tapered alignment pins 5 are fully retracted
from the frame 4.  The conductive paste pattern 8 is now fully
developed and printed on the conductive paste carrier 6.  Paste
stalactites 9 are created during this thick film separation process
because of an acceleration of the screening mask 2 away from the
conductive paste carrier 6.  This acceleration is a result of
adhesion characteristics between the screening mask 2, the conductive
paste 3 and the conductive paste carrier 6.

      Fig. 1C details the screening of the second conductive paste
carrier 6.  Frame 4 is again secured in position by clamps 1.  The
second conductive paste carrier 6, supported by structure 7, is again
aligned and placed against screening mask 2, using tapered alignment
pins 5.  Paste stalactites 9 (Fig. 1B) from the previous thick film
deposition process are compressed between the screening mask 2 and
the conductive paste carrier 6, resulting in extraneous thick film
paste 10 between these two structures.

      Fig. 1D details the results of the second thick film deposition
and separation processes.  Paste bleed 11 is created during the
second thick film process because of the extraneous thick film paste
10 (Fig.  1C).  Paste stalactites 9 are also recreated during this
thick film process.  The paste bleed 11 may result in pattern and/or
su...