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Positioning Mechanism for Electron Beam Drilling

IP.com Disclosure Number: IPCOM000120608D
Original Publication Date: 1991-May-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 6 page(s) / 179K

Publishing Venue

IBM

Related People

Brown, ME: AUTHOR [+2]

Abstract

A positioning mechanism is described to enable greensheets, as used in the construction of semiconductor circuit boards, to be accurately positioned for electron beam drilling. The mechanism is non-magnetic and is shielded from ceramic particles. Materials will not deteriorate under exposure to high vacuum and X-ray conditions.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Positioning Mechanism for Electron Beam Drilling

      A positioning mechanism is described to enable
greensheets, as used in the construction of semiconductor circuit
boards, to be accurately positioned for electron beam drilling.  The
mechanism is non-magnetic and is shielded from ceramic particles.
Materials will not deteriorate under exposure to high vacuum and
X-ray conditions.

      Fig. 1 is the front view of the mechanism and Fig. 2 is a
top view of the mechanism.  Fig. 1 illustrates the basic positioning
components of the mechanism and shows how X-Y stage 1 and the various
tooling assemblies, consisting of bellows assembly 5, shield assembly
6 and mirror assembly 7, are positioned relative to carrier assembly
4 under electron beam column 3.

      Details of mirror assembly 7 are shown in Figs. 3a and 3b.
Fig.  3a is a top view and Fig. 3b is a front view. Details of
shield assembly 6 are shown in Figs. 4a and 4b. Fig. 4a is a top
view and Fig.  4b is a front view.  Shield assembly 6, as shown in
Fig. 1, mounts on top of mirror assembly 7.  Bellows assembly 5, as
shown in Fig. 1, is shown in detail in front view Fig. 5a, top view
Fig. 5b and side view Fig. 5c. Laser assembly 10, as shown in Fig. 2,
is shown in detail in Fig. 6.

      During the operation of the positioning mechanism, chamber
assembly 2, as shown in Figs. 1, 2 and 6, is at high vacuum.  X-Y
stage 1 along with its tooling, bellows assembly 5, shield assembly 6
and mirror assembly 7 are at the home position.

      Bellows assembly 5, as shown in Fig. 1, consists mainly of
upper bellows 17, bellows 18 and lower frame 19.  Lower frame 19 is
mounted to mirror assembly 7.  Bellows assembly 5 mates with shield
assembly 6 which is attached to the...