Browse Prior Art Database

Disposable Encapsulation Injector

IP.com Disclosure Number: IPCOM000120671D
Original Publication Date: 1991-May-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 32K

Publishing Venue

IBM

Related People

Woodard, HR: AUTHOR

Abstract

Described herein is a tool developed to facilitate the application of liquid encapsulant at the module/carrier interface. Generic dispense tools, although capable, require elevated temperatures, are slow, costly and require considerable space. (Image Omitted)

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This is the abbreviated version, containing approximately 100% of the total text.

Disposable Encapsulation Injector

      Described herein is a tool developed to facilitate the
application of liquid encapsulant at the module/carrier interface.
Generic dispense tools, although capable, require elevated
temperatures, are slow, costly and require considerable space.

                            (Image Omitted)

      Depicted is a disposable molded injector capable of using
standard syringes and solder ball connect (SBC) module and carrier.
The injector employs a three-sided seal to the module, a four-sided
seal to the carrier and a full-width orifice that allows an ambient
temperature injection process.  The dispense cycle control (time and
pressure) is achieved through a commercially available dispense
station.

      This injection technique is fast, safe, controllable,
inexpensive and is expandable to larger module applications.

      Disclosed anonymously.