Browse Prior Art Database

Microcellular Circuit Board Structures

IP.com Disclosure Number: IPCOM000120689D
Original Publication Date: 1991-May-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 28K

Publishing Venue

IBM

Related People

Christie, FR: AUTHOR [+4]

Abstract

Disclosed are printed circuit structures fabricated by combining a microcellular closed cell film of very low dielectric constant with an epoxy based prepreg as an adhesive layer.

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Microcellular Circuit Board Structures

      Disclosed are printed circuit structures fabricated by
combining a microcellular closed cell film of very low dielectric
constant with an epoxy based prepreg as an adhesive layer.

      The circuit board structure is prepared by laminating a glass
fiber reinforced epoxy prepreg to a microporous film. The
microcellular film consists of a very fine closed cells of average
diameter 1-5 microns.  Film thickness could vary from 3-6 mils.
Cellular films in general may consist of base polymers, such as
polyimides, polyethersulfones, polyphenylquinoxalines and poly
parabanic acid.

      By laminating Cu foil to the microcellular film through the use
of FR-4 prepreg under standard lamination conditions, a copper clad
laminate can be fabricated and circuitized using a conventional
circuitization process. Non-prepreg-type adhesives can also be used.
These include thermoplastic and thermoset adhesive films.

      Disclosed anonymously.