Browse Prior Art Database

Thin Film Islands (Expansion Bridges)

IP.com Disclosure Number: IPCOM000120708D
Original Publication Date: 1991-May-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 32K

Publishing Venue

IBM

Related People

Gregerson, JC: AUTHOR

Abstract

Disclosed is a method for adding more thin film layers to congested areas of a thermal conduction module (TCM).

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Thin Film Islands (Expansion Bridges)

      Disclosed is a method for adding more thin film layers to
congested areas of a thermal conduction module (TCM).

      The idea is to add small areas, called islands, of thin film to
the TCM.  Gaps between thin film islands are a key ingredient.

      Thermal expansion/contraction deltas between the base material
and the thin film cause adhesion difficulties.  The larger the X-Y
area, the greater the problem.  This problem, and certain processing
problems, limit the number of thin film layers which can be applied
to the TCM.  Thin film islands act like expansion bridges by reducing
the X-Y area and by providing gaps.

      The figure illustrates an example of thin film islands. The
size, shape and quantity of thin film islands per TCM are variable.
The number of thin film layers per island is variable.  A progression
in the Z direction of different size and shape islands is possible.

      Disclosed anonymously.