Browse Prior Art Database

High Density Edge Connector System for Circuit Modules

IP.com Disclosure Number: IPCOM000120722D
Original Publication Date: 1991-May-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Grebe, KR: AUTHOR [+5]

Abstract

Disclosed is a method for making a large number of connections to the face of a ceramic or glass-ceramic circuit module.

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This is the abbreviated version, containing approximately 100% of the total text.

High Density Edge Connector System for Circuit Modules

      Disclosed is a method for making a large number of connections
to the face of a ceramic or glass-ceramic circuit module.

      On a circuit module, the signal lines are routed to regions
near the edge of the module.  Each line is brought to the face of the
module and terminated in a raised metallic pad with a flattened top.
The pads are arranged in multiple staggered rows along the edges of
the module.  An interposer is constructed of the same material as the
circuit module in order to avoid differential thermal expansion of
the mated pieces.  The interposer is fabricated with an array of
holes matching the array of pads on the module.  Each hole is fitted
with a thin wire connector of the "buckling beam" type.  The ends of
these buckling beams extend a short distance beyond the surface of
the interposer and contact the metallic pads on the circuit module
when the module is installed.  More permanent connections to the side
of the interposer opposite the module are made by joining multiple
flex cables to the stationary end of the buckling beams.  When the
system is assembled, a mechanical fixture aligns the module to the
interposer and maintains pressure between the buckling beams and the
module effecting electrical contact.

      Disclosed anonymously.