Browse Prior Art Database

Impedance-Matched Stacked Direct Access Storage Device Cooling Duct

IP.com Disclosure Number: IPCOM000120780D
Original Publication Date: 1991-Jun-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 67K

Publishing Venue

IBM

Related People

Cook, WG: AUTHOR [+4]

Abstract

Disclosed is a computer package-mounting method for Direct Access Storage Devices (DASDs) to provide controlled, balanced airflow path through multiple parallel channels without preheat. DASDs are mounted in staggered stacks. A stepped plate divides adjacent DASDs and forms the airflow paths. A plate step geometry is chosen which matches the contraction/expansion losses to achieve balanced airflow impedance. Both top and bottom files receive cool air with no upstream preheating. Shadow and blockage effects are eliminated. Plate dimensions may be arranged to accommodate electronics cards or other mechanical devices which require forced air cooling.

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Impedance-Matched Stacked Direct Access Storage Device Cooling Duct

      Disclosed is a computer package-mounting method for
Direct Access Storage Devices (DASDs) to provide controlled, balanced
airflow path through multiple parallel channels without preheat.
DASDs are mounted in staggered stacks.  A stepped plate divides
adjacent DASDs and forms the airflow paths.  A plate step geometry is
chosen which matches the contraction/expansion losses to achieve
balanced airflow impedance.  Both top and bottom files receive cool
air with no upstream preheating.  Shadow and blockage effects are
eliminated.  Plate dimensions may be arranged to accommodate
electronics cards or other mechanical devices which require forced
air cooling.

      Note how the parts divide the airflow through a stacked
staggered DASD layout.  Refer to Fig. 1.  A sheet metal bracket 1 is
offset with a step 2 to form a reversible duct/mounting plate which
houses a DASD 3.  The bracket 1 is flipped over to provide the
opposing wall of the duct.  This is repeated multiple times depending
on the number of DASDs being housed.  Each duct houses a DASD 3 which
is screwed directly to the duct wall.  Fig. 2 shows an assembly for a
4-DASD enclosure.

      Air enters at 6 and goes past upper file 5.  Air contracts into
chamber 7, then exits the chamber.  Air entering chamber 9 contracts
at 10, then flows out chamber to exit.  The relative geometry of
expansion/contraction produces pressure d...