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Thick Film Mask Process for Buckling DTF/Parallel Process Compensators With Via Studs

IP.com Disclosure Number: IPCOM000120875D
Original Publication Date: 1991-Jun-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 72K

Publishing Venue

IBM

Related People

Berasi, PH: AUTHOR [+5]

Abstract

This article details a packaging construction which provides a stable metal compensator with integral vias and conductive studs. The studs are insulated from the metal compensator with a polymer dielectric. This article also details the process methods applicable to fabrication of such a unit.

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Thick Film Mask Process for Buckling DTF/Parallel Process Compensators
With Via Studs

      This article details a packaging construction which
provides a stable metal compensator with integral vias and conductive
studs.  The studs are insulated from the metal compensator with a
polymer dielectric.  This article also details the process methods
applicable to fabrication of such a unit.

      Hardware has been fabricated by two methods.  The first method
provides for definition of an image in thick film photoresist,
followed by additive formation of the compensator unit with integral
via hole and stud by a process, such as plating metallurgy onto a
sacrificial conductive layer.

      The second method utilizes subtractive processes in which the
compensator with stud is formed by processes such as etching a metal
foil through to an underlying polymer layer.

      Both methods are capable of producing identical images which
are then capable of being coated with a suitable dielectric to form
the final unit.  The methods and type of images produced are shown in
the figure.

      The advantages of the integral via/stud construction are
numerous and are as follows:  simultaneous fabrication of compensator
and stud providing reduction in processing time; elimination of
registration requirements due to one-sided processing; elimination of
laser ablation requirements; elimination of complex thin film
processes for via stud fabrication; consistency in elec...