Browse Prior Art Database

Spin-Clean Ultrasonic Jet Cleaner

IP.com Disclosure Number: IPCOM000120895D
Original Publication Date: 1991-Jun-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 72K

Publishing Venue

IBM

Related People

Vigliotti, DR: AUTHOR [+2]

Abstract

A common method for cleaning microelectronic parts is to use a spin- clean system. This device involves the use of a high pressure vertically directed water jet, incident on a rotating part below. The part is disposed in a plane which is at right angles to the incident jet stream. The nozzle of the jet is attached to a reciprocating arm so that the entire part can be accessed. Often, the high pressure of the water column causes damage, particularly when repaired circuits are subjected to the jet stream. A mathematical analysis of the forces exerted by the conventional spin-clean device indicates very large horizontal forces in the region of the boundary layer of the jet. These forces are at times strong enough to destroy the repair metallurgy since typical circuit lines are vulnerable to shear forces.

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This is the abbreviated version, containing approximately 60% of the total text.

Spin-Clean Ultrasonic Jet Cleaner

      A common method for cleaning microelectronic parts is to
use a spin- clean system.  This device involves the use of a high
pressure vertically directed water jet, incident on a rotating part
below.  The part is disposed in a plane which is at right angles to
the incident jet stream.  The nozzle of the jet is attached to a
reciprocating arm so that the entire part can be accessed.  Often,
the high pressure of the water column causes damage, particularly
when repaired circuits are subjected to the jet stream.  A
mathematical analysis of the forces exerted by the conventional
spin-clean device indicates very large horizontal forces in the
region of the boundary layer of the jet.  These forces are at times
strong enough to destroy the repair metallurgy since typical circuit
lines are vulnerable to shear forces.

      A modified spin-clean device is described which operates at a
significantly lower hydrostatic pressure and does not rely on shear
forces to obtain effective cleaning of the microelectronic board or
module.  The high pressure water column is replaced by a low pressure
jet with pressures on the order of 1/2 atmosphere.  At this pressure,
the lateral or shear forces are reduced by at least two orders of
magnitude compared to devices now used. Sufficient water flow,
however, is still present to rinse away loose or loosened debris.
The device is shown in the figure.  An ultrasonic jet operating at
low pressure de...