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Electrically Selectable Interconnections Or Inverse Fuses

IP.com Disclosure Number: IPCOM000120910D
Original Publication Date: 1991-Jun-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Cook, HC: AUTHOR [+2]

Abstract

A method for creating stable electrical connections between initially isolated circuit elements is described. Use of this method allows initially isolated sub-circuit elements (for testing or personalization) to be subsequently electrically connected. Also, by using this method in conjunction with fuseable links, redundant circuit elements can be substituted for failing elements to increase product yield.

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This is the abbreviated version, containing approximately 52% of the total text.

Electrically Selectable Interconnections Or Inverse Fuses

      A method for creating stable electrical connections
between initially isolated circuit elements is described.  Use of
this method allows initially isolated sub-circuit elements (for
testing or personalization) to be subsequently electrically
connected.  Also, by using this method in conjunction with fuseable
links, redundant circuit elements can be substituted for failing
elements to increase product yield.

      The actual geometry of the linking structures may take several
forms; all consist of two or more metallic conductors that are
electrically isolated by a dielectric. The conductors may be located
in a single plane, a "lateral" structure, or the conductors may be
located in different wiring planes, a "cross-point" structure.  The
formed interconnections are functionally equivalent to jumper wires
and vias for the lateral and cross-point structures, respectively.
These conductors must be within a critical distance at the desired
link location.  That is, the dielectric material which separates the
conductors should have a minimum thickness (which results in a lower
breakdown voltage) at this location.  This distance must be tailored
such that normal circuit voltages will not trigger this reaction.  In
order to promote electrical breakdown of the dielectric and form a
metal bridge at the desired location, the conductors must have some
asperity or roughness at this point to increase the local electrical
field.  A preferred method to create this increased field region is
to introduce a matrix of low melting point metal particles into the
gap between the conductors.  The population of particles must be low
enough to ensure electrical isolation until the connection is made.

      The connecting link is formed by the remote applic...