Browse Prior Art Database

TCM Hat Customization

IP.com Disclosure Number: IPCOM000120954D
Original Publication Date: 1991-Jun-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Abrami, A: AUTHOR [+2]

Abstract

TCM design is faced with an increasing problem of temperature spread from chip to chip due to varying individual chip powers on the substrate. The invention discloses the use of customized pistons.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

TCM Hat Customization

      TCM design is faced with an increasing problem of temperature
spread from chip to chip due to varying individual chip powers on the
substrate.  The invention discloses the use of customized pistons.

      The piston customization would be assigned to three generic
wattage categories which are CMOS chips, BJT arrays, and BJT logic.
Each chip category would receive its own piston type in this scheme.
For example, the high wattage chips (BJT logic) would have the state
of the art or preferred piston while the low power CMOS chips would
be matched with a back level piston architecture. Historically, the
evolution of piston thermal resistance has focused on physical
dimensions, with interim values being dependent on the change of
piston to chip contact area, piston crown and sidewall taper.  These
physical dimensions can be varied to produce a discrete set of piston
types, each with their own thermal resistance values, that can be
matched to the corresponding low or high wattage chips on the same
substrate and hat assembly.

      Disclosed anonymously.