Browse Prior Art Database

Ultra-High Vacuum-Holding Apparatus for Thin Film Deposition

IP.com Disclosure Number: IPCOM000120956D
Original Publication Date: 1991-Jun-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 1 page(s) / 44K

Publishing Venue

IBM

Related People

Duerr, FW: AUTHOR [+2]

Abstract

Described is an ultra-high vacuum-holding apparatus to be used during the thin film deposition of wafers, as used in the fabrication of semiconductor devices. The primary purpose of the apparatus is to provide proper positioning of wafers in front of electron beam evaporators.

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Ultra-High Vacuum-Holding Apparatus for Thin Film Deposition

      Described is an ultra-high vacuum-holding apparatus to be used
during the thin film deposition of wafers, as used in the fabrication
of semiconductor devices.  The primary purpose of the apparatus is to
provide proper positioning of wafers in front of electron beam
evaporators.

      The apparatus, as shown in the figure, contains a multiple
storage chamber (not shown) which is connected through valves (not
shown) to vacuum chamber 10.  The wafer-handling device (not shown)
transfers wafers between the storage chamber and an analytical
chamber (not shown). The wafer-handling device positions wafer 11 in
front of two ion sources of an electron beam evaporator (not shown)
moving in a vertical direction.  The motion is achieved through a
mechanism comprised of double-bellowed ball-joystick type vacuum
assembly 12. Clamps 13 are provided on each side for holding wafer 11
against the side of the apparatus.  The device is equipped with
radiant heating capabilities.

      Disclosed anonymously.