Browse Prior Art Database

Thin Film Repair Process for Interlevel Electrical Connectors (Stud Metal Repair)

IP.com Disclosure Number: IPCOM000120971D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Economikos, L: AUTHOR [+2]

Abstract

In the fabrication of thin films on the surface of ceramic modules, stud metal is used to connect electrically the one level of thin films to the next level of thin films. Numerous studs can be fabricated per substrate. Contamination and debris from the laser via ablation process cause some studs to be defective during fabrication. Defective studs contain voids or an absence of interconnecting metal. Disclosed is a unique method of repairing defective studs whereby damaged studs receive pyrolytic chemical vapor deposition of metal using a guided laser beam. The disclosed stud metal repair process quickly renders the substrate fully functional, electrically interconnecting the thin film levels.

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Thin Film Repair Process for Interlevel Electrical Connectors (Stud
Metal Repair)

      In the fabrication of thin films on the surface of
ceramic modules, stud metal is used to connect electrically the one
level of thin films to the next level of thin films. Numerous studs
can be fabricated per substrate. Contamination and debris from the
laser via ablation process cause some studs to be defective during
fabrication. Defective studs contain voids or an absence of
interconnecting metal.  Disclosed is a unique method of repairing
defective studs whereby damaged studs receive pyrolytic chemical
vapor deposition of metal using a guided laser beam.  The disclosed
stud metal repair process quickly renders the substrate fully
functional, electrically interconnecting the thin film levels.

      After inspection the defective studs are heated by a finely
focused laser beam in a chamber containing an organometallic
compound.  The organometallic compound deposits metal by pyrolytic
decomposition precisely at the hot spot.  Metal fills the stud void
making the stud homogeneous.  Since the stud metallurgy, copper, is
an excellent heat conductor, the entire stud top surface receives
some extra metal.  The extra metal that deposits above the plane of
the insulator surface is polished back by a light lap polishing to
flatten the top surface of the repaired studs.

      One specific process used to repair copper studs is disclosed
below.  An organometallic compound is ...