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Browse Prior Art Database

D3z-High Density Three-Dimensional Electronic Package

IP.com Disclosure Number: IPCOM000120983D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 4 page(s) / 134K

Publishing Venue

IBM

Related People

Bhatt, AC: AUTHOR [+3]

Abstract

Disclosed is a high density three-dimensional electronic package. A unique feature of this package is the signal-ground pairs to form "triplate" microstrip wiring and achieve Z-wiring without plated through holes. This package allows chips to be positioned back to back to allow short-lengths of unidirectional wiring between chips.

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D3z-High Density Three-Dimensional Electronic Package

      Disclosed is a high density three-dimensional electronic
package.  A unique feature of this package is the signal-ground pairs
to form "triplate" microstrip wiring and achieve Z-wiring without
plated through holes.  This package allows chips to be positioned
back to back to allow short-lengths of unidirectional wiring between
chips.

      Fig. 1 shows how X and Y conductors are isolated from each
other by etching back their top and bottom edges below the surface
after polishing.  X-Y interconnection is direct without having to go
through a via.  The unetched extension of the X line and Y line is
bonded together at a desired location.

      Wiring in the Z-direction is accomplished by built-in short
conductor segments positioned along side of the signal and ground
conductors but isolated from them by dielectric. These are built in
during the initial lay-up of the laminated D3 sub-assembly layers by
installing copper foil layers having etched segments (Fig. 2).  After
the D3 sub-assembly is sliced, these conductor segments appear as in
Fig. 3.  When all the D3 sub-assemblies are laminated, they form a
continuous electrical path in the Z direction through package or also
can be extended as far as necessary.

      Each Z conductor segment is sufficiently long enough to make a
"jumper" connection between X-line (or Y-line) and adjacent Z line.
Sections of conductors even with the dielectric surface provide con
nections between Z wiring and X-Y wiring.  Where no connection is
desired, X and Y conductor's surfaces are e...