Browse Prior Art Database

Encapsulation of Multiple Voltage Power Cores

IP.com Disclosure Number: IPCOM000121008D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2005-Apr-02
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Dibble, EP: AUTHOR [+2]

Abstract

Disclosed is a construction for an encapsulated multi-voltage power core. This construction extends the reliability benefits of encapsulation technology (the prevention of signal-to-power leakage shorts) to any high wiring density core designed with isolated/multiple voltage requirements. Thin multi-voltage core handling cost reductions and enhanced conveyoribility are made possible by this construction when utilized with conventional photolithography and encapsulation techniques. High density multilayer printed circuit card yield savings are achieved when joining high-reliability/low-cost multi-voltage power cores.

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Encapsulation of Multiple Voltage Power Cores

      Disclosed is a construction for an encapsulated
multi-voltage power core.  This construction extends the reliability
benefits of encapsulation technology (the prevention of
signal-to-power leakage shorts) to any high wiring density core
designed with isolated/multiple voltage requirements.  Thin
multi-voltage core handling cost reductions and enhanced
conveyoribility are made possible by this construction when utilized
with conventional photolithography and encapsulation techniques.
High density multilayer printed circuit card yield savings are
achieved when joining high-reliability/low-cost multi-voltage power
cores.

      The figure illustrates a free-standing sheet of copper, coated
on one side with a thin film encapsulant. Conventional
photolithography processes are utilized to print and etch the
personalized multi-voltage image into the thin core.  The
personalized multi-voltage core is coated with encapsulant and
relaminated with high-performance dielectric.