Browse Prior Art Database

Automatic Flux Applicator

IP.com Disclosure Number: IPCOM000121101D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Atkins, A: AUTHOR

Abstract

An applicator system is disclosed that applies controlled quantities of liquid flux to pre-soldered component sites on a flexible circuit cable. The system comprises a flux reservoir, peristaltic pump, flux bath, bath level sensor, and an applicator unit. It provides a closed flux environment eliminating flux evaporation and contamination. It operates with a 'failsafe' overflow method from the flux bath should the bath level sensor and pump control fail. The system may also be used with other liquids where controlled application and liquid containment is required.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 73% of the total text.

Automatic Flux Applicator

      An applicator system is disclosed that applies controlled
quantities of liquid flux to pre-soldered component sites on a
flexible circuit cable.  The system comprises a flux reservoir,
peristaltic pump, flux bath, bath level sensor, and an applicator
unit.  It provides a closed flux environment eliminating flux
evaporation and contamination. It operates with a 'failsafe' overflow
method from the flux bath should the bath level sensor and pump
control fail. The system may also be used with other liquids where
controlled application and liquid containment is required.

      With reference to the figure, a peristaltic pump 1 evacuates
air through the flux bath 2 overflow outlet 3 in the event of a flux
overflow.  The air is pumped into the sealed reservoir container 4,
thus pressurizing and forcing flux 5 into the bath 2.  The level
sensor 6 switches the pump 1 on and off via a control device 7.  When
the level is high, the sensor 6 activates the pump 1 OFF.  When the
level drops too low, pump 1 is switched on.  The system ensures that
the quantity of flux 5 pumped into the bath 2 cannot exceed that
which the overflow 3 can extract.

      An applicator unit 8 situated above the flux bath 2 lifts flux
from the bath to the target solder sites by loading concave ended
pins 9 with droplets of flux.  The quantity of flux transferred is
accurately controlled by the volume of the concave pin profile.  The
pins are spring-loaded p...