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Browse Prior Art Database

Flex-Piston Heat Sink an Heater Hat Assembly

IP.com Disclosure Number: IPCOM000121112D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Lopergolo, EF: AUTHOR

Abstract

Disclosed is a device addressing improvements to the art of cooling heat produced when powering integrated circuits (IC) chips as in the TCM product, and the heating of ICs during the accelerated burn-in process. Described is a water-cooled flexible piston heat sink hat assembly which is in direct contact with IC chips.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Flex-Piston Heat Sink an Heater Hat Assembly

      Disclosed is a device addressing improvements to the art
of cooling heat produced when powering integrated circuits (IC) chips
as in the TCM product, and the heating of ICs during the accelerated
burn-in process.  Described is a water-cooled flexible piston heat
sink hat assembly which is in direct contact with IC chips.

      Referring to the figure, shown is the integral flex piston heat
sink A welded or screwed in place to a metal plate B, which has an
upper cover C to create a water flow chamber.  This chamber is
manufactured to be leak tight with water as the cooling media.  The
inlet and outlet of the fluid can be introduced and exited in various
configurations.  Once this assembly is placed over the module and
sealed, the area in which the flex pistons are located can then be
filled with helium or oil to enhance the thermal interface between
the chip and piston.  Also, shown in the diagram is a series of heat
probes D located in each piston which would be used to elevate chip
temperature for accelerated burn-in.

      Reference
"Flexible Piston," IBM Technical Disclosure Bulletin 32, 28 (April
1990).