Browse Prior Art Database

Plastic Board With Molded Features Interfaced to a Logic Substrate

IP.com Disclosure Number: IPCOM000121155D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 49K

Publishing Venue

IBM

Related People

Ferraro, A: AUTHOR [+3]

Abstract

Described is a plastic circuit board molded with features such as connectors and battery/speaker mounts on an upper surface and is combined with polyimide film on its underside to permit tape automated bonding (TAB) mounting of components to achieve a multi-layer circuit board. The combining of these attributes into a single package can provide an effective replacement for the current planar board and supporting hardware.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 89% of the total text.

Plastic Board With Molded Features Interfaced to a Logic Substrate

      Described is a plastic circuit board molded with features such
as connectors and battery/speaker mounts on an upper surface and is
combined with polyimide film on its underside to permit tape
automated bonding (TAB) mounting of components to achieve a
multi-layer circuit board.  The combining of these attributes into a
single package can provide an effective replacement for the current
planar board and supporting hardware.

      The drawing shows the plastic circuit board of this disclosure.
It is approximately the size of a planar board. The molded-in
features include molded-in connectors 1, battery/speaker holders 2
and holes 3 to provide clearance for components TAB mounted to
polyimide film on the bottom surface of the board.  The outer edges
of the TAB circuit are solder reflowed to 50 MIL contacts on the
board.  The board material is polyetherimide shaped to fit the
application need with a thickness of .062 inches.

      The concept of interfacing the plastic board to a logic
substrate presently is viewed as multi-chip TAB on polyimide film.
The TAB process will encompass the majority of digital logic within
multi-chips onto a single piece of polyimide and this, in turn, will
be made to interface to the board and its associated connector
scheme.  The board provides structural strength to the TAB film and
provides additional interconnections as required.

      Power circuitr...