Browse Prior Art Database

Mechanically Align and Vapor Phase Solder Quadpacks

IP.com Disclosure Number: IPCOM000121170D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 29K

Publishing Venue

IBM

Related People

Bender, TK: AUTHOR [+2]

Abstract

Vapor phase soldering of quadpacks to printed wiring boards with predeposited solder on the surface patterns is inhibited by quadpack lead misalignment. A method to eliminate this misalignment is to mechanically constrain the quadpack location during vapor phase soldering. This is done by bonding tooling pins 1 between the surface circuitry 3 of the printed wiring board 6 with a removable adhesive 5 prior to quadpack assembly. The quadpack devices are then assembled such that the leads 2 rest on the predeposited solder 4 between the tooling pins. After soldering is complete the tooling pins and adhesive are removed. (Image Omitted)

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Mechanically Align and Vapor Phase Solder Quadpacks

      Vapor phase soldering of quadpacks to printed wiring boards
with predeposited solder on the surface patterns is inhibited by
quadpack lead misalignment.  A method to eliminate this misalignment
is to mechanically constrain the quadpack location during vapor phase
soldering.  This is done by bonding tooling pins 1 between the
surface circuitry 3 of the printed wiring board 6 with a removable
adhesive 5 prior to quadpack assembly.  The quadpack devices are then
assembled such that the leads 2 rest on the predeposited solder 4
between the tooling pins.  After soldering is complete the tooling
pins and adhesive are removed.

                            (Image Omitted)

      Disclosed anonymously.