Browse Prior Art Database

Package for Multiple Circuit Elements Operating at Low Temperature

IP.com Disclosure Number: IPCOM000121195D
Original Publication Date: 1991-Jul-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Grebe, K: AUTHOR [+4]

Abstract

Disclosed is a method for mounting a large number of circuit elements on a single refrigerated cold head for operation at reduced temperature.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 89% of the total text.

Package for Multiple Circuit Elements Operating at Low Temperature

      Disclosed is a method for mounting a large number of circuit
elements on a single refrigerated cold head for operation at reduced
temperature.

      It is well known that the operation of certain semiconductor
circuit elements (e.g., Silicon CMOS and GaAs) at cryogenic
temperatures (<150~K) offers substantial performance advantages when
compared to room temperature operation.  It is also desirable from
arguments of service and installation to operate computers using such
elements without liquid cryogens.  This leads directly to the concept
of mounting the circuit elements on a cold head cooled by a closed
cycle refrigerator and extracting the heat by conduction.  Given the
refrigeration power of cryogenic refrigerators and the dissipation of
individual circuit elements, it is necessary to mount a large number
of circuit elements on a single cold head and still provide adequate
thermal conduction and electrical connection.  The mounting method
must allow for the widely differing thermal contractions of the
various components as the system is cooled from room temperature.
This is accomplished by the method of the figure.  Individual circuit
elements are mounted on multi-chip modules (MCM) which are, in turn,
thermally anchored to heatsinks.  These heatsinks are thermally
attached to the refrigerated cold plate via flexible thermal joints.
A similar flexible mechanical connection is effecte...