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Browse Prior Art Database

Chip Test/ Burn-in Socket

IP.com Disclosure Number: IPCOM000121209D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Iguchi, Y: AUTHOR

Abstract

Metal bumps built in a replaceable polyimide film are used for the connection between the C4 pads of a VLSI chip and the land pattern of a circuit board of the chip test and burn-in socket. This enables the functional testing and burn-in of the VLSI chip at chip level without any package.

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Chip Test/ Burn-in Socket

      Metal bumps built in a replaceable polyimide film are
used for the connection between the C4 pads of a VLSI chip and the
land pattern of a circuit board of the chip test and burn-in socket.
This enables the functional testing and burn-in of the VLSI chip at
chip level without any package.

      As shown in the figures, gold plated metal bumps 16 are built
at the entire region of thin polyimide film 14 at high density.  The
bumps 16 extend through the film 14.  The film 14 is placed on
circuit board 18 assembled in the socket and having socket pins 20.

      At the time of test and burn-in, VLSI chip 10 is put into the
cavity of the chip socket and then pressed down against the metal
bumps 16 by lid 24 of the socket.  The hard bumps 16 act to remove
oxide films on the C4 solder bumps 12 to achieve low resistance
interconnection between the lands 22 of the circuit board 18 and the
C4 bumps 12. When the film 14 in use is degraded or damaged, it can
be replaced by a new one with ease.