Browse Prior Art Database

Optoelectronic Photoreceiver Package With Lid Aligning Submount

IP.com Disclosure Number: IPCOM000121254D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Delman, D: AUTHOR [+3]

Abstract

Disclosed is a semiconductor package 10 for use in optoelectronics (see Fig. 1). The design of the component parts provides for the greatest use of real-estate for components under the lid while providing for other traditional requirements. The submount provides for both holding chips and maintaining lid alignment. The reverse pedestal provides for reliable welding of the lid by reducing the material to traditional thicknesses.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 76% of the total text.

Optoelectronic Photoreceiver Package With Lid Aligning Submount

      Disclosed is a semiconductor package 10 for use in
optoelectronics (see Fig. 1).  The design of the component parts
provides for the greatest use of real-estate for components under the
lid while providing for other traditional requirements.  The submount
provides for both holding chips and maintaining lid alignment.  The
reverse pedestal provides for reliable welding of the lid by reducing
the material to traditional thicknesses.

      A detector chip or integrated detector is mounted in the center
of the submount 11 with other components when needed, e.g., a
capacitor 12.  The submount with rounded ends 13 on a diameter
slightly smaller than the minimum lid interior (see dimension 14 in
Fig. 2) aligns the lid for welding (see Figs. 3 and 4).  Tolerances
of the chips and placement are taken into account and the lid will
not extend over the edge of the header 15.  The lid to submount fit
chosen provides for normal high-speed production welding.

      The lid flange, represented by dimension 16 in Fig. 1, is
narrow while still providing for welding.

      A reverse pedestal header 17 provides a reduced material
section.  The thickness is reduced to be consistent with standard
weld practices.  This reduces weld time and pressure in prior
industry practice.  The relief 18 also provides a region for the
glass seal to be less affected by the welding temperatures.

      Addition...