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Cooling Package With Flow-through Heat Sinks for Single and Multi-Chip Microelectronic Circuit Modules

IP.com Disclosure Number: IPCOM000121306D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 4 page(s) / 149K

Publishing Venue

IBM

Related People

Ellsworth, MJ: AUTHOR [+2]

Abstract

A conventional multi-chip circuit module, as shown in the figures, is comprised of microelectronic computer chips 101 attached to a substrate 102 in a row and column array. A heat sink 103, formed by a plurality of plate-fins 201 and having flow channels 202 between the individual plates, is held by a spring 104 in contact with each chip. The face 203 of the heat sink is prepared in a way that is consistent with present piston cooling technology to achieve good thermal contact with the chip. The heat sink is engaged by a square or rectangular hole in a hat-like structure 105. Each hole is open to a coolant distribution plenum 106. This hat/plenum structure is manufactured from a suitable metal or plastic using conventional machine tools, or by known powder metallurgy or injection molding processes.

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Cooling Package With Flow-through Heat Sinks for Single and Multi-Chip
Microelectronic Circuit Modules

      A conventional multi-chip circuit module, as shown in the
figures, is comprised of microelectronic computer chips 101 attached
to a substrate 102 in a row and column array.  A heat sink 103,
formed by a plurality of plate-fins 201 and having flow channels 202
between the individual plates, is held by a spring 104 in contact
with each chip.  The face 203 of the heat sink is prepared in a way
that is consistent with present piston cooling technology to achieve
good thermal contact with the chip.  The heat sink is engaged by a
square or rectangular hole in a hat-like structure 105. Each hole is
open to a coolant distribution plenum 106. This hat/plenum structure
is manufactured from a suitable metal or plastic using conventional
machine tools, or by known powder metallurgy or injection molding
processes.  As the coolant flows into the module it is distributed to
the top of each heat sink through the plenum.  Heat dissipated by a
chip is conducted into the plate fins and, as the coolant flows
through the channels between the plate-fins, is transferred to the
fluid.  The effluent is discharged near the base of the heat sink and
is collected in a periphery channel 107, from which it is discharged
from the module.

      The plate-fins are manufactured to have one thickness t1 in
some areas 204 and a lesser thickness t2 in other areas 205.  The
ratio t1/t2 is typically between 1.2 and 2.0.  Thickness t1 is
typically between 0.25 and 0.5 mm. Plate-fins 201 are stamped from
conventional multigauge metal strip 301.  More complex raised
structures, such as a staggered array of circular posts or dimples
401, 501, veins 502 and ribs 503, 504 are formed by conventional
etching or deposition processes, or in conjunction with the stamping
operation.  When a num...