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Browse Prior Art Database

Fanout Board Cooling Device for Electronic Module Burn-in System

IP.com Disclosure Number: IPCOM000121316D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Buliszyn, S: AUTHOR [+3]

Abstract

Disclosed is a device to precisely vector compressed air within a confined area which facilitates cooling on an electrically powered circuit board.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 84% of the total text.

Fanout Board Cooling Device for Electronic Module Burn-in System

      Disclosed is a device to precisely vector compressed air
within a confined area which facilitates cooling on an electrically
powered circuit board.

      In Fig. 1, airjet manifold 1 is shown isometrically with inlet
port 2 and outlet orifices 3.  Orifices 3 and inlet port 2 are
drilled in such a manner to facilitate channeling of compressed air
through the orifices 3.  For electronic module burn-in system (EMBIS)
fanout board application, orifices 3 are drilled to 0.042" in
diameter using the following equation for a sharp-edged orifice:
                       _            1/2   _   1/2
                        Q x (460 + T)
                 d =   --------------------
                       _    172 + Pu      _
where     Pu = upstream air pressure (psi gauge)
           T  = upstream air temperature (oF)
           d  = diameter of orifice (in)
           Q  = air volume (CFM)

      These orifices are drilled at an angle of 65 degrees with
respect to the base of the airjet to facilitate the vectoring of the
air as shown exiting airjet 1 in Fig. 2.

      In Fig. 2, airjet 1 is shown in a cut-away side view mounted on
stiffener 2 and against circuit board 3.  Power board 5 provides
electrical current to substrate 4 through ZIF (zero-insertion...