Browse Prior Art Database

Adhesive Apply Device

IP.com Disclosure Number: IPCOM000121347D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 4 page(s) / 172K

Publishing Venue

IBM

Related People

Barenboim, M: AUTHOR [+5]

Abstract

Described is a device that is designed to automatically apply a precisely dimensioned epoxy adhesive rectangular-shaped dot onto a read/ write head.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 46% of the total text.

Adhesive Apply Device

      Described is a device that is designed to automatically
apply a precisely dimensioned epoxy adhesive rectangular-shaped dot
onto a read/ write head.

      In prior art, the application of the adhesive in read/write
head assemblies required the use of a microscope and the manual
insertion of the adhesive to a read/write head.  The concept
described herein eliminates manual microscope operations in applying
the adhesive. Although the concept describes the adhesive apply
device for use in read/write head assemblies, the concept can be
applied to other applications.

      Figs. 1, 2 and 3 are shown for reference only and are not part
of the apply device.  Fig. 1 shows head suspension assembly (HSA) 1
which requires the application of the epoxy adhesive.  HSA 1 consists
of magnetic head 2 attached to flexure 3 which, in turn, is welded to
load beam 4.  Wiring harness 5 is shown routed to magnetic head 2.

      Fig. 2 shows the tooling device 6 which is used to hold HSA 1
and wiring harness 5 in place during the adhesive apply operation.
Fig. 3 shows HSA 1 loaded and secured to tooling fixture 6 by means
of sliding plate 7 and transfer fixture 8.  Tooling fixture 6 clamps
HSA 1 by means of latches 9 retaining both load beam 4 and magnetic
head 2 properly positioned in respect to one another throughout the
curing process.

      Fig. 4 shows the actual adhesive apply device consisting of
four major components:  a) adhesive dispensing unit 10; b) squeegee
assembly 11; c) paper drive assembly 12; and d) pick-and-place
mechanism 13.  Tooling fixture 6 is precisely located and secured to
support plate 14 by means of clamp 15.  Clamp 15 can be moved via
slide 16 for loading/ unloading tooling fixture 6 and the four major
components of the device.  Support plate 14, clamp 15 and slide 16
are not part of the device, but are shown to aid in describing the
adhesive apply process.

      Dispensing unit 10 is a commercially available unit and is
connected to adapter head 18 to provide pre-mixed adhesive at
cartridge 17 to cartridge guide 19.  Cartridge guide 19 is mounted in
squeegee assembly 11 so that the end of cartridge 17 is just above
paper 21.

      Squeegee assembly 11 is mounted to pick-and-place mechanism 13
to provide a gap so as to form the desired thickness of adhesive.
The gap can be adjusted by lowering or raising spring-loaded blade 20
in relation to paper 21. This operation is accomplished by means of
screws 22 and 23. When blade 20 needs to be cleaned, it can easily be
released by turning quarter-turn screws 24.

      Paper drive assembly 12 is designed to provide the necessary
intermittent rolling motion of paper 21 and at the same time to
assure the flatness of paper 21 at all times. Paper 21 is standard
calculator paper in roll form which is changed when it is used up.
Paper loading starts from its clamping position onto spring-loaded
idler reel 25.  It is then t...