Browse Prior Art Database

Microfin Cooling

IP.com Disclosure Number: IPCOM000121356D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 3 page(s) / 91K

Publishing Venue

IBM

Related People

Anderson, TM: AUTHOR [+3]

Abstract

Disclosed herein is a new method, MicroFin Cooling (MFC), for direct immersion cooling of high-power computer chips by natural or forced convection to a gas or dielectric liquid. MicroFins may also be used in pool or convective boiling applications with liquid coolants. Potential liquids for convection or boiling include liquid nitrogen and fluorocarbons.

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This is the abbreviated version, containing approximately 58% of the total text.

Microfin Cooling

      Disclosed herein is a new method, MicroFin Cooling (MFC),
for direct immersion cooling of high-power computer chips by natural
or forced convection to a gas or dielectric liquid. MicroFins may
also be used in pool or convective boiling applications with liquid
coolants.  Potential liquids for convection or boiling include liquid
nitrogen and fluorocarbons.

      An array of small fin structures 101 are distributed over and
attached directly to the back of each chip 102. Fig. 1 is an example
in which a staggered array of pin fins has been vapor deposited on
the chip through a photoresist or other mask.  This same process is
used to deposit solder on the front of chips for Controlled Collapse
Chip Connections (C4) 103.  MicroFins would be deposited with similar
diameter, height and pitch as the C4 material.  The fins, however,
could be copper or another good thermal conductor, as well as solder.

      Fig. 2 is a second example of MicroFin Cooling in which vapor
deposited solder bumps 201 are used to join an array of heat sink
structures 202 to the back of the chip 203. These structures could be
joined simultaneously in a furnace reflow operation similar to that
used to join chips to a substrate.  Alternatively, a tool that is fed
by one or more continuous lengths of the heat sink material (e.g.,
spools of wire) could align the MicroFin array over the solder bumps
for joining, supply heat to reflow the solder, and cut the heat sinks
t...