Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Thermal Component Shrouds for I.R. Reflow Component Thermal Protection

IP.com Disclosure Number: IPCOM000121379D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 62K

Publishing Venue

IBM

Related People

Winstead, R: AUTHOR

Abstract

During the electrical card assembly processes, components are subjected to infrared (I.R.) radiant and convective heat sources which effectively reflows the solder paste & electrically connects the component(s) to the circuit substrate(s). Unfortunately, many of the currently available components cannot survive or withstand the required heat inputs during this reflow process without damage occurring to the component(s). By using a carefully made shroud or shield designed to insulate the vulnerable component(s) from heat induced by radiant or convective means, these same components can be used in an I.R. reflow process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 62% of the total text.

Thermal Component Shrouds for I.R. Reflow Component Thermal Protection

      During the electrical card assembly processes, components are
subjected to infrared (I.R.) radiant and convective heat sources
which effectively reflows the solder paste & electrically connects
the component(s) to the circuit substrate(s).  Unfortunately, many of
the currently available components cannot survive or withstand the
required heat inputs during this reflow process without damage
occurring to the component(s).  By using a carefully made shroud or
shield designed to insulate the vulnerable component(s) from heat
induced by radiant or convective means, these same components can be
used in an I.R. reflow process.

      The shroud/shield is designed to closely fit the component
outline and insulate, shield, and protect the area(s) of
vulnerability due to thermal damage.  The shroud/shield is also
designed to expose those component leads and surfaces which require
heat for proper solder reflow.  The shroud/shield is made of high
temperature plastic and metal with features to minimize heat transfer
by absorption of radiation or convective heat input.  The metal outer
layer of the shroud/shield is polished or plated to maximize
reflection and simultaneously provide mechanical support and
temporary (snap on/off) retention to the component being protected.
The shroud/shield is molded of high temperature plastics which will
withstand I.R. reflow temperatures without damage.  The hig...