Browse Prior Art Database

Improved Capture Pad Metallurgy

IP.com Disclosure Number: IPCOM000121403D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Kraycir, JR: AUTHOR [+3]

Abstract

Metallized ceramic electronic packaging products have occasionally incurred blisters on vacuum deposited Cr-Cu-Cr capture pads. There have also been instances of separation at the Cr-Cu interface under conditions of moderate force prompted by: 1) oxidation of the Cr which had been accelerated by the presence of C1, and, 2) separation at the Cr-Cu interface as a result of stresses during thermal processing.

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Improved Capture Pad Metallurgy

      Metallized ceramic electronic packaging products have
occasionally incurred blisters on vacuum deposited Cr-Cu-Cr capture
pads.  There have also been instances of separation at the Cr-Cu
interface under conditions of moderate force prompted by:
      1)   oxidation of the Cr which had been accelerated by the
presence of C1, and,
      2)   separation at the Cr-Cu interface as a result of stresses
during thermal processing.

      This is a form of stress corrosion that takes place at the
sharp, non-alloyed interface between Cr and Cu.

      This condition can be corrected by adding an additional
alloying layer that serves to bond to these two materials by
diffusing between the Cr and Cu, and thus eliminating the sharp
interface.  It has been found that two materials useable in this
process are Au and Ni which readily diffuse into Cr or Cu at normal
processing temperatures (380-550 degrees C) for multi- layer ceramic
packages.

      Disclosed anonymously.