Browse Prior Art Database

Ultrasonic Method to Remove Chips Mounted on Ceramic or of Other Materials Substrates

IP.com Disclosure Number: IPCOM000121404D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Behun, JR: AUTHOR [+5]

Abstract

The removal of chips mounted on some type of a substrate ceramic or of other materials without harming the chip itself and also without harm to the mother substrate can be accomplished by the use of ultrasonic power at room temperature conditions.

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This is the abbreviated version, containing approximately 100% of the total text.

Ultrasonic Method to Remove Chips Mounted on Ceramic or of Other
Materials Substrates

      The removal of chips mounted on some type of a substrate
ceramic or of other materials without harming the chip itself and
also without harm to the mother substrate can be accomplished by the
use of ultrasonic power at room temperature conditions.

      As shown in the Figure, the substrate 1 is placed on the
surface of the base of the ultrasonic tool 2 (the substrate may or
may not be chucked).  The chip remove stud 3 is mounted on the
ultrasonic transducer 4 by means of a set screw 5.  The transducer
itself is mounted on the tool base such that an upward force can be
exerted on it and to permit it to slide up and down.  The substrate
is now moved to align the chip to be removed with the remove stud.

      A small amount of quick curing adhesive is applied on the chip
6.  The stud 3 is now lowered to contact the chip. Finger power
accomplishes this.  After the cure has set, an upward controlled
force is applied to the transducer 4.

      The ultrasonic transducer is connected electrically to obtain
power from the ultrasonic power supply (power supply not shown).
Ultrasonic power is now applied for 30 seconds or until separation
occurs.

      The stud with the chip on it is now replaced with a new stud
so that the operation will continue to remove the next chip.

      Disclosed anonymously.