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Opens Repair Technique for 2.0 Mil Lines On PTFE Materials

IP.com Disclosure Number: IPCOM000121419D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 57K

Publishing Venue

IBM

Related People

Foster, E: AUTHOR [+5]

Abstract

The demand for increased circuit density in electronic packaging has brought about a growing interest in the use of perfluorinated hydrocarbon polymers, such as polytetrafluorothylene (PTFE) because of their inherent low dielectric constants (2.0-2.8). These materials can be purchased as virgin polymer (such as Teflon) or as a filled material to enhance their mechanical properties (such as Rogers Corp. 2800 Series materials). Since Teflon materials have a low surface energy and are hydrophobic, metallization is usually difficult and often results in poor metal adhesion. This property also presents problems in making repairs (brazes) in open circuit lines. By reducing the surface of fluoropolymer materials, a chemical surface modification results in improved adhesion properties.

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Opens Repair Technique for 2.0 Mil Lines On PTFE Materials

      The demand for increased circuit density in electronic
packaging has brought about a growing interest in the use of
perfluorinated hydrocarbon polymers, such as polytetrafluorothylene
(PTFE) because of their inherent low dielectric constants (2.0-2.8).
These materials can be purchased as virgin polymer (such as Teflon)
or as a filled material to enhance their mechanical properties (such
as Rogers Corp. 2800 Series materials).  Since Teflon materials have
a low surface energy and are hydrophobic, metallization is usually
difficult and often results in poor metal adhesion.  This property
also presents problems in making repairs (brazes) in open circuit
lines.  By reducing the surface of fluoropolymer materials, a
chemical surface modification results in improved adhesion
properties. Described below are the results of using the reducing
treatment along with a specific brazing process for insuring high
quality reliable circuit repairs for 2 mil wide, 0.4 mil thick Cu
metal circuits on RO2810 material.

      By utilizing a benchtop braze tool (United Unibond II, model
#1-191-01) one can repeatedly effect reliable brazes for 2.0 mil wide
Cu lines, with a thickness of >0.20 mils. The probe that was used was
a Weldmatic Corporation Model #11-082-01-20, although a smaller probe
tip such as the Catalog #VTM111L would be suggested for smaller line
dimensions.  The Brazer ribbon used was purchased from Handy...