Browse Prior Art Database

High Performance Dielectric Repair Thermoplastic

IP.com Disclosure Number: IPCOM000121420D
Original Publication Date: 1991-Aug-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 33K

Publishing Venue

IBM

Related People

Feger, C: AUTHOR [+3]

Abstract

Disclosed is a method that can be used to repair and fill holes in a raw printed circuit board with an amorphous fluoropolymer dielectric, (Teflon AF - Trademark of E. I. du Pont de Nemours & Company). Although this material has limited solubility in perfluorinated alkane solvents (Fluorinert FC's - Trademark of the 3M Company) in the range of 3% to 10%, it is sufficient to dissolve the Teflon AF for laying a thin film of material free of pinholes.

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High Performance Dielectric Repair Thermoplastic

      Disclosed is a method that can be used to repair and fill holes
in a raw printed circuit board with an amorphous fluoropolymer
dielectric, (Teflon AF - Trademark of  E. I. du Pont de Nemours &
Company).  Although this material has limited solubility in
perfluorinated alkane solvents (Fluorinert FC's - Trademark of the 3M
Company) in the range of 3% to 10%, it is sufficient to dissolve the
Teflon AF for laying a thin film of material free of pinholes.

      A solution of 8% Teflon AF 1600 in Fluorinert FC-77 (by weight)
is prepared.  This is dispensed with a syringe into holes 100
micrometers in depth and breadth, and the excess material is removed
with a flexible spatula.  An ambient temperature 1 hour air dry in a
laboratory hood is adequate to flash off the solvent.  Fluorinert
FC-77 has a 25-degree centigrade vapor pressure of 42 Torrs and is
not considered a toxic pollutant.

      Cross-sectioning of the holefill area revealed an excellent
seal that has a low dielectric constant, non-flammability, chemical
resistance and easily withstands elevated temperature processing.

      Disclosed anonymously.