Browse Prior Art Database

Chip Structure for Chip On Glass

IP.com Disclosure Number: IPCOM000121472D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Sakamoto, K: AUTHOR [+2]

Abstract

Disclosed is a chip structure for chip on glass (COG) packaging of a liquid crystal display (LCD). An image defect, such as an uneven brightness picture, is caused by conventional COG packaging shown in Fig. 1, wherein output signal bumps are arranged on peripheral sides of a chip, and output lines of various length are required, so that a resistance of the line differs from each other to cause the uneven brightness.

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Chip Structure for Chip On Glass

      Disclosed is a chip structure for chip on glass (COG)
packaging of a liquid crystal display (LCD).  An image defect, such
as an uneven brightness picture, is caused by conventional COG
packaging shown in Fig. 1, wherein output signal bumps are arranged
on peripheral sides of a chip, and output lines of various length are
required, so that a resistance of the line differs from each other to
cause the uneven brightness.

      Fig. 2 shows the chip structure.  Output signal bumps are
located on one side of the chip edge.  Input signal bumps and dummy
bumps are on the opposite side.  The bumps on the chip and the
patterns on the glass substrate are connected by pressure.  Dummy
bumps are required to press the chip uniformly.  In this chip
structure, each pattern has the same length between the connection
area and the LCD area and no resistance difference exists.  The
uneven brightness picture is not caused with this chip.

      The COG package with this chip has one more merit.  The
packaging area can be reduced for this package. Reduction of the
packaging area results in cost reduction.