Browse Prior Art Database

Stacked, Thin Film Heat Sink

IP.com Disclosure Number: IPCOM000121488D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Mok, LS: AUTHOR

Abstract

Described is a heat sink which has fins made of thin metal plates stacked together at its base so as to provide high efficiency cooling of semiconductor circuitry.

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Stacked, Thin Film Heat Sink

      Described is a heat sink which has fins made of thin
metal plates stacked together at its base so as to provide high
efficiency cooling of semiconductor circuitry.

      In prior art, many heat sinks were made of castings and
extrusions. Because of process constraints, the fins of heat sinks
made of castings and extrusions were generally thicker than required
from a thermal point of view.  Generally, the aspect ratio of a fin,
i.e., the fin's height divided by its thickness which is larger than
twenty, can be difficult to attain by means of castings and
extrusions.  In order to increase the cooling power of a given base
size of a heat sink, taller fins are needed.  However, the use of
castings and extrusions could lead to unacceptable fin thickness and
could make the space between the fins too narrow for the cooling air
to pass through.

      Fin spacing is considered an important parameter that affects
the heat sink performance and should be optimized for the environment
where the heat sink is to be used.  The concept described herein
eliminates heat sink thickness and height constraints by providing
the ability to choose any thickness, height, and spacing as required
for the heat sink's application.

      The stacked, thin fin heat sink, as shown in Fig. 1, consists
of thin plates 11 and base blocks 12 made of any suitable thermal
conductive material, such as aluminum or copper.  All of the thin
plates 11 and base...