Browse Prior Art Database

Short Repair in Voids

IP.com Disclosure Number: IPCOM000121495D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Koblinger, O: AUTHOR [+2]

Abstract

The disclosed method repairs shorts between adjacent conductors 2, 3, which occur when ceramic substrates 1 are metallized. These shorts occur in the region of voids 4 caused by the porosity of the ceramic material. As the porosity of the ceramic material also leads to weak points in the metal conductors, a first thin metallic (redundancy) layer 5 is covered with a second layer 2, 3 to ensure electrical continuity.

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Short Repair in Voids

      The disclosed method repairs shorts between adjacent
conductors 2, 3, which occur when ceramic substrates 1 are
metallized.  These shorts occur in the region of voids 4 caused by
the porosity of the ceramic material.  As the porosity of the ceramic
material also leads to weak points in the metal conductors, a first
thin metallic (redundancy) layer 5 is covered with a second layer 2,
3 to ensure electrical continuity.

      Figs. 1 to 3 show that during the application of the first
layer 5, a metallic layer is also formed in voids 4. As these voids
may be very deep, a subsequent structuring step of a first
photoresist layer 6, in which the metal conductors are defined, does
not remove all of the resist from the voids.  In the subetch step
(Fig. 2), the resist in the voids prevents the metallic layer from
being removed. With large voids, the two adjacent metal conductors 2,
3 may be short- circuited by metallic layer residues (Fig. 3).

      This problem may be solved by a multilayer resist (MLR) step,
as shown in Figs. 4 and 5.  The surface of conductors 2, 3,
short-circuited by the first layer 5, is provided with a second
resist layer 7, followed by a barrier layer 8 and a third resist
layer 9.  After the barrier layer 8 has been opened by means of the
third resist layer 9 in the region of the short-circuited conductors
2, 3, the second resist layer 7 may be overetched in an anisotropic
(RIE) step such that no resist remains in...