Browse Prior Art Database

Surface Mount Socket Assembly for Flat Pack Modules

IP.com Disclosure Number: IPCOM000121515D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 3 page(s) / 70K

Publishing Venue

IBM

Related People

McAskill, RD: AUTHOR [+3]

Abstract

A large flat pack can be connected to a circuit card via a surface mount connector, as shown in Figs. 1-3. This packaging concept would minimize potential damage to the valuable component due to soldering conditions, as well as allow for engineering changes to module functionality and replacement of a malfunctioning component without solder rework of the circuit card. Additionally, it is designed so that probe points may be provided in the top piece to allow in situ testing to be performed on an actual product card.

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Surface Mount Socket Assembly for Flat Pack Modules

      A large flat pack can be connected to a circuit card via
a surface mount connector, as shown in Figs. 1-3.  This packaging
concept would minimize potential damage to the valuable component due
to soldering conditions, as well as allow for engineering changes to
module functionality and replacement of a malfunctioning component
without solder rework of the circuit card.  Additionally, it is
designed so that probe points may be provided in the top piece to
allow in situ testing to be performed on an actual product card.

      Referring to the figures, base 1 is an electrical insulator
into which conductive spring clips 2 are affixed. The bottoms of 2
are soldered to a card footprint.  A flat pack module 6 is nested
into 1 such that 4 is aligned to the top of 2.  The top piece
of the connector 3 is also made of an electrically non-conductive
material and is clamped to 1 using corner fasteners.  If external
probing is required, probe wire 5 can be installed in holes molded
into 3 and clamped between 3 and 1, making electrical contact with 2.