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Browse Prior Art Database

Flex Single Inline Module or Integrated Card Packaging Technique

IP.com Disclosure Number: IPCOM000121525D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Andrejack, JM: AUTHOR [+8]

Abstract

A semiconductor package is shown which defines a technique for terminating leads from multilayers of flex circuits by laminating them into a single component surface.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 78% of the total text.

Flex Single Inline Module or Integrated Card Packaging Technique

      A semiconductor package is shown which defines a
technique for terminating leads from multilayers of flex circuits by
laminating them into a single component surface.

      Prior card fabrication methods mount components and device
packages on card surfaces, resulting in thick packages. To meet fine
pitch card requirements, techniques such as wafer backside grinding
or chemical milling have been required. A new method is shown which
involves mounting components and devices into a card plane consisting
of low temperature flex circuit materials which terminate leads in
devices and interlayer interconnection sites. The entire flex circuit
is then laminated into a card outline frame for support and provides
I/O edge connections.

      Referring to the figure, single or double-sided personalized
copper circuit line material is etched to provide openings at device,
component and interconnect sites. Ground, power and signal layers are
laminated, as required. Devices, component and interconnect leads are
left extended into open areas from all layers. Heat- or
pressure-sensitive adhesive tape is utilized to extend leads into
open areas, affix devices and components, and to attach the composite
flex circuit structure to the outline frame. Low temperature Al,Au
ultrasonic wedge bonds or selective heated thermosonic Au,Cu
ball/wedge wire bond techniques are utilized to interconnect devices
to the flex...