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Film Tape for Circuit Repairing

IP.com Disclosure Number: IPCOM000121534D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 24K

Publishing Venue

IBM

Related People

Yamanaka, K: AUTHOR

Abstract

Disclosed is a film tape which supports copper wires used for the repair of open circuits.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Film Tape for Circuit Repairing

      Disclosed is a film tape which supports copper wires used
for the repair of open circuits.

      The repair film is made as follows.  First, one or more
openings are formed, as by etching, in an insulating film tape, such
as polyimide with a thin copper layer thereon. Then, the copper layer
is etched to form copper wires which extend across the openings, with
both ends of the wires supported by the film.  The order of the
opening etching and copper etching may be reversed.  Also, the copper
layer may be affixed on the film after the opening etching, followed
by copper etching. The copper may be plated with one or more metals,
such as Ni, Au, for better welding.

      At the time of repairing, the wires will be removed from the
film and welded onto open circuit lines.  No or little wire damage is
expected during handling or transportation because the wires are
supported as a part of the film structure.