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Nozzle Plate for Wave Soldering

IP.com Disclosure Number: IPCOM000121548D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 39K

Publishing Venue

IBM

Related People

Fujiuchi, S: AUTHOR [+2]

Abstract

Disclosed is a nozzle plate of a wave soldering machine for reducing soldering defects.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 93% of the total text.

Nozzle Plate for Wave Soldering

      Disclosed is a nozzle plate of a wave soldering machine
for reducing soldering defects.

      Surface mount components are usually solder-bonded to pads on a
circuit board, with reflow soldering being used for bonding on the
front side and wave soldering being used for bonding on the back
side.  In particular, open defects are apt to occur in the wave
soldering for bonding components on the back side.  Experiments have
shown that gas trapped at the bonding areas prevents liquid solder
from making contact with metal surfaces or pads to be soldered and
causes the open defects.

      It has been found that the problem of open defects on the back
side can be solved by improving the nozzle plate used in wave
soldering.  The new nozzle plate is shown in the figure.

      This plate has many solder flow-out holes which are arranged in
lines making an angle of 30-60 degrees to the board transport
direction. The slanting of the lines of flow-out holes makes it easy
to remove gas from the soldering area and exhaust gas behind the
wave, and contributes to the reduction of soldering defects.

      The board transport path is usually slightly inclined upward
while the plate is placed horizontally.  Thus the distance from the
plate to the board gradually increases in the board transport
direction.  To make the height of solder flows from the plate holes
uniform regardless of the variation in distance, smaller and larger
f...