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Support for Printed Circuit Card Wave Soldering

IP.com Disclosure Number: IPCOM000121628D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Nolting, JS: AUTHOR

Abstract

Disclosed is a TEFLON* insert for a board support (sometimes referred to as a "ski") used in the solder wave in printed circuit card soldering.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Support for Printed Circuit Card Wave Soldering

      Disclosed is a TEFLON* insert for a board support
(sometimes referred to as a "ski") used in the solder wave in printed
circuit card soldering.

      Wide boards, which tend to sag when being wave soldered, are
supported in the solder wave by resting on board supports.  On some
boards, titanium supports cause damage to the soldermask (protective
coating) as the board slides over the support.

      Fig. 1 shows a TEFLON insert added to the top of the board
support on a wave soldering device.  The insert is 1/32" thick, 1/8"
tall and is the length of the board support.  It rests in a slot
which has been cut into the top of the board support (1/32" wide by
1/10" deep).  It is held in place by two small clamps, which are
loosened or tightened with an allen wrench.  This allows quick
replacement of the TEFLON insert as it wears.  Fig. 2 shows three
views of the board support.

      The protruding edge of the TEFLON insert provides the required
support, but allows the board assemblies to slide without sustaining
damage to the soldermask.  TEFLON will withstand continuous service
in temperatures up to 550 degrees Fahrenheit.  Glass filled TEFLON
may be used to extend the life of the inserts.  Replacement inserts
are sheared out of standard 1/32" thick sheets of TEFLON. No
machining is required, so replacement inserts are inexpensive.
*  Trademark of E. I du Pont de Nemours & Co.