Browse Prior Art Database

Machine On a Wafer

IP.com Disclosure Number: IPCOM000121682D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 67K

Publishing Venue

IBM

Related People

Schrottke, G: AUTHOR [+2]

Abstract

The idea of this disclosure is to combine the technologies of mixed logic and memories on a single piece of silicon with that of silicon chips on a silicon carrier to form an entire machine on a wafer. The machine I/O's are then bonded to another carrier, which is used to convey the signals to the proper I/O devices.

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Machine On a Wafer

      The idea of this disclosure is to combine the
technologies of mixed logic and memories on a single piece of silicon
with that of silicon chips on a silicon carrier to form an entire
machine on a wafer.  The machine I/O's are then bonded to another
carrier, which is used to convey the signals to the proper I/O
devices.

      The machine is built as follows:  The required machine memory,
with sufficient redundancy to account for yield losses, is grown into
a wafer, as shown in Figure 1.  The memory I/O's are brought out to
test pads so that the memory devices embedded in the wafer can be
totally tested.  After testing, the devices that test good are wired
to the memory-controlled pads.  This can be done by wire bonding the
good devices or breaking fusible links in devices that test bad.
Logic devices are grown into the remaining wafer and are wired, as
required, to the memory devices.  This can be done easily since
typically memory and logic are both done with equivalent complex
circuitry. External chips, such as a processor chip set, which might
be more easily obtained as discrete devices, can be mounted to the
top of the wafer, to appropriate pads which are wired to embedded
logic or memory circuits.  This wiring is easily done on the surface
of the silicon.  The external chips are shown top view in Figure 1
and side view in Figure 2.  The preferred method of attachment of the
chips is to use C4 or flip-chip technology.  When the...