Browse Prior Art Database

Thermal Carrier for Power Applications

IP.com Disclosure Number: IPCOM000121761D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Laboy, LO: AUTHOR [+4]

Abstract

Disclosed is a method to fabricate a printed circuit carrier to provide thermal dissipation for high power-integrated circuits. The circuit carrier may range from a two-sided carrier to a full multi-layer carrier.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 67% of the total text.

Thermal Carrier for Power Applications

      Disclosed is a method to fabricate a printed circuit
carrier to provide thermal dissipation for high power-integrated
circuits.  The circuit carrier may range from a two-sided carrier to
a full multi-layer carrier.

      After fabricating a circuit carrier through conventional means,
the circuit carrier is laminated onto a heat sink (a thick metal
plate or a pre-fabricated heat sink) by means of a thermally
conductive, electrically insulating adhesive film.  In order to
provide a direct thermal path from the carrier top side to the heat
sink, a window that will contain the high power-integrated circuit is
removed from the circuit carrier and the adhesive film. This
operation may be performed using a multi-up punch or routing process.

      The composite may now be assembled with surface mount
components and back-boned chips.  The high power chips are soldered
directly to the thick metal plate.  Interconnection is achieved with
ultrasonic wire bonding from chip to carrier.  Refer to the figure.

      Depending on particular application requirements, process
variations exist as follows:
      A.   The thick metal back plate may serve as a ground plane, as
well as a heat sink.  Ground plane interconnections can be achieved
by solder filled blink vias, plated through holes, pin-in-hole or
around-the-edge connectors.
      B.   Chip window can be punched on the carrier before the
adhesive laminat...